The Power Stamp Alliance has defined a standard product footprint and functions that provide a multiple-sourced, standard modular board-mounted solution for power conversion for 48Vin to low voltage, high current applications.

These 48V direct conversion DC-DC modules - or 'power stamps' - primarily target devices being used in large data centers, high performance computing (HPC) and supercomputing applications

Processor architectures being addressed by the Power Stamp Alliance include ASICs, AI accelerators, FPGAs, GP-GPUs, ASSPs, CPUs, and network processors moving to lower geometry, such as 3 nanometer technology.

48V single stage power conversion offers HPC, supercomputing and data center companies a range of business and technical benefits.

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